On January 5-6, 2017, the 2016 Gaogong LED Annual Meeting and Golden Globe Awards Ceremony and the 10th Anniversary of High-Industry Research and Development (2006-2016) hosted by Gaogong LED The celebration was held in Shenzhen.
On the afternoon of January 5th, in the special forum of "The Next Technical Battle of Packaging" by Hyun Shuo Optoelectronics, the chairman of Liyang Co., Ltd., Qu Junyi, gave a keynote speech on "Flip the COB to open a new era of high-power lighting applications."
Li Junyi, Chairman of Liyang Co., Ltd.
Qu Junyi pointed out that the packaging structure is undergoing changes, and more and more LED companies are transforming the packaging form to improve the production efficiency, shorten the production cycle and reduce the production cost. Among them, the advantages of the flip-chip package form are more obvious.
In particular, flip-chip wafers, superconductors, processes and equipment, and applications have many advantages. Among them, the flip chip has a better luminous flux maintenance rate under the condition of high current use, and the flip chip has a smaller upward floating voltage and a higher light efficiency maintenance rate when the current is used.
At the same time, the inverted COB series is equipped with a new superconducting material in the industry - ALC aluminum substrate. The thermal conductivity is up to 120W/MK, using a glueless process, no insulation insulation, and integrated circuit boards, which greatly reduces thermal resistance. At the same time, the light efficiency of the product is also obviously superior to the traditional dressing products, which lays a solid foundation for the cost reduction of the lamps.
The integration of COB in the flip-chip integrates the heat conduction problem of the integrated light source and makes the product hot channel smoother. At the same time, in the production process, the professional testing equipment - X-Ray (cavity rate testing equipment) is monitored throughout the process, the quality of the products is strictly controlled, and the product quality is greatly improved.
Qu Junyi believes that the market demand for LED light source is gradually increasing, pursuing high quality, high luminous efficiency and high cost performance, and the emergence of flip-chip light source caters to the market demand. Flip COB is the development trend in the next few years.
It is worth noting that despite the large market demand, there are still some difficulties in the large-scale popularization of flip-chip LEDs.
For example, the upstream chip's brand and size selection (relative to dress) is less, flip chip capacity and upstream will not match, flip-chip LED technology is currently more advantageous in medium and high power products and integrated packaging, in low power In terms of application, the cost competitiveness is not very strong. Flip-chip LEDs have subverted the traditional LED process. From chip to package, the requirements for production and testing equipment are higher. The high cost and high threshold have made some enterprises unable to apply.
The development of flip-chip LED technology will focus on high-power and high-light density output devices, while the development direction will gradually transition to Flip-chip on PCB (FCOB) and standardized optical components.
It is understood that Liyang has been in line with international first-line brands in the process and equipment for flip-chip LED manufacturing. In the process of making the substrate solder paste, Liyang has adopted the world's leading 3D automatic printing technology, eutectic welding, high efficiency and high reliability. At the same time, in the monitoring equipment, Liyang is equipped with advanced automatic The X-RAY cavity rate monitor monitors the production of the whole process and greatly improves the quality.
At present, the inverted LED production line of Liyang has been successfully mass-produced, and its quality is stable and imported into various products.
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