So what is a smart sensor? A sensor is an electronic device that simulates human senses and collects external information. The intelligence of a sensor is like the realization of some functions of the human brain and nervous system. From the sense to the process of thinking, it is called â€œwisdomâ€; the result of wisdom is produced. Behavior and language, and the process of expression of behavior and language is a kind of â€œabilityâ€, both of which are collectively called â€œsmartâ€. The connotation conferred on the sensor intelligence can have multiple levels and degrees. Like the performance of human intelligence and ability, the â€œintelligence quotientâ€ and â€œenergy quotientâ€ can be used to describe the extent to which intelligence is exerted in an individual. Therefore, the intelligence and ability of smart sensors will also evolve from a simple naive stage to a complex abstraction stage. Sensors that can simulate some functions of the human brain and nervous system to some extent are called smart sensors. Sensors that have certain functions for information processing, analysis of detected parameters, or the ability to store information or convert information analysis results into other instructions can all be called smart sensors. For example, the technology and the sensor are combined with the microprocessor, and the sensor's sensitive element, its signal conditioning circuit and the microprocessor are integrated on a single chip. This can be called a sensor with preliminary intelligence. Smart sensors combine ASIC circuits, microprocessors, communication interfaces, and software protocols with sensitive chips to make the most sensitive use of sensitive chip sensing information.
Integration, miniaturization, multi-functionalization, intelligence, and networking are trends in the development of sensors, but integration and miniaturization are the basis of this trend. Only integrated and miniaturized technologies can achieve low-cost, low-power consumption, High performance, versatility, intelligence and networking. Therefore, from the foundation of this implementation, intelligence and networking are the goals, and integration and miniaturization are the means to achieve this goal. Based on the integration and miniaturization technologies, more advanced intelligence factors are integrated into an overall structure. This is the smart microsystem. Intelligent microsystems require more integration of subject knowledge and technology.
As a whole, the major bottleneck in the development of miniaturization and integration of the current domestic sensor industry is the lack of capacity in China's IC and MEMS technology industry chain. Both in terms of technical quality, production capacity, and the scale of production, are far behind the international advanced technologies. bigger. As far as the sensor products are concerned, despite the strong single product technology, overall, there are still low reliability, lack of research on basic technologies and manufacturing processes, backward product performance and functions, long product technology update cycles, and bottom-up application requirements. Design basic issues such as less. China's scientific research and development level of sensors is about 5 to 10 years behind the developed countries, and production technology is about 10 to 15 years behind.
Smart sensors are currently the hotspots and frontiers of sensor research in the world. To vigorously carry out smart sensor research is a leap-forward development approach that we should adopt, and it is a key measure for ushering in the strategy of the future of information technology. The public information market is a huge market for smart sensor applications. Taking market demand as the traction and expanding the information consumer market to promote the smart sensors in China is very straightforward. Under the support of the State Councilâ€™s â€œSome Opinions on Accelerating the Promotion of Information Consumption and Expanding Domestic Demand,â€ Chinaâ€™s smart sensors will be developed from technology to products. It will develop faster than expected, and form a virtuous cycle in terms of technological innovation, product industrialization, and expanding market share. China's measures to expand information consumption have injected a powerful impetus for the development of smart sensors, so seizing the opportunity to substantially increase the comprehensive strength of Chinaâ€™s sensor research and production and establish a smart sensor high-tech industry is Chinaâ€™s future in the field of information technology. The important foundation of status.
Considering the layout of the national economic structure, it is necessary to focus on the systematic advancement of the entire IC and sensor industry chain, increase government support, establish an industry common technical service platform, provide support for independent innovation and sustainable development of the industry, and achieve the overall development level of the industry. Significant improvement; Encourage cross-industry joint business model, support the completion of a number of independent design, development and industrialization of high-precision smart sensors; Organizations of various research institutions to solve the key issues of intelligent and networked sensor backbone products. Breaking through the blockade technically and relying mainly on independent innovation technologies on smart sensors, it has advanced in the development of next-generation information technology.
8 Layer PCB - Stackup & Cost & Prototype manufacture
What is 8 layer PCB?
The 8 layer PCB is a circuit board with 8 layers that are stacked firmly together with predefined and dependable mutual connections between the layers. Structure of eight layer PCB is more complicated. Nowadays, PCBs frequently have 8 to 12 layers or more, and electronics engineers know that designing for so many layers requires a well-configured layer stack.
8-layer Printed Circuit Boards are usually installed in compact equipment with strict spacing requirements, such as notebook computer motherboard, communication backplane, wearable watches, etc. Because of its complexity and high manufacturing costs, your 8-layer PCB Manufacturing should be made by reliable and experienced manufacturers. Jinghongyi PCB has been specially targeting high-end PCB manufacturing and assembly services for 8 years, providing high-quality products and services for various customers. Our advanced production line and fast response team will keep you comfortable and reassured, without any trouble, you can rest assured to place the order with us.
Typical 8-layer PCB stack up methods and guidelines
Standard stackup of 8 layer PCB looks as follows
Eight-layer PCB can be used to add two additional layers, or two planes can be added to improve EMC performance. Most eight-layer circuit boards are superimposed to improve EMC performance, rather than adding additional wiring layers. Compared with 6-layer circuit boards, the cost increase percentage of 8-layer PCB is less than that of 4-layer PCB to 6-layer PCB. Therefore, in order to improve EMC performance, the cost increase is reasonable. Therefore, most 8-layer boards consist of four wiring layers and four planes.
8 Layer PCB Stack up
8 Layer PCB stackup
In short, 8 layer PCB are usually used to improve the EMC performance of circuit boards, rather than increasing the number of layers.
No matter how you decide on the stack layer, it is not recommended to use an 8-layer PCB Board with six wiring layers. If you need six routing layers, you should use a 10 Layer PCB board. Therefore, the 8-layer board can be regarded as the six-layer board with the best EMC performance.
Basic Layer of Eight-Layer Circuit Board with Excellent EMC Performance
All signal layers are adjacent to the plane, and all layers are tightly coupled. High-speed signals are buried between planes, so planes provide shielding to reduce the transmission of these signals. In addition, the circuit board uses multiple grounding layers to reduce the grounding impedance.
Other forms of 8-layer PCB stackup
A typical 8 Layer PCB Stackup
0.062[8 layer PCB stackup
0.093[ 8-Layer PCB Stackup
So far, we have also clarified the cost and price differences between 6-layer PCB, 8-layer PCB and 10-layer PCB.
8 Layer PCB thickness
8 LAYER 1.6 MM STANDARD STACKUP AND THICKNESS
8 Layer Stackup - 1.6mm thickness
|layer order||layer name||material type||material description||dielectric constant||thickness||copper weight|
|2||inner 1||copper||plane||1 oz|
|3||inner 2||copper||plane||1 oz|
|4||inner 3||copper||plane||1 oz|
|5||inner 4||copper||plane||1 oz|
|6||inner 5||copper||plane||1 oz|
|7||inner 5||copper||plane||1 oz|
|Final board thickness: 1.6mmÂ±0.13mm|
8-Layer Prototype PCB Manufacturing Service
The 8-layer prototype FR-4 PCB is an 8-layer circuit board, which is firmly stacked together with predefined and reliable interconnection between layers. The 8-layer FR-4 PCB has more complex structure. Jinghongyi PCB is a large enterprise located in Shenzhen, China, which can manufacture 8-layer prototype PCB.
Jinghongyi PCB can provide you with multi-layer PCB board in accordance with RoHS standard. With laminated material, it can match high temperature in assembly process. Importantly, some lead-free assembly processes will require laminated substrates to withstand temperatures exceeding 260 degrees Celsius or 500 degrees Fahrenheit over a longer period of time. To solve this problem, we have high temperature laminates in stock, so that our customers can meet the higher temperature cycle requirements of some lead-free assembly applications.
JHY PPCB is one of the leading 8 layer PCB manufacturers. For more information, pls send email to us.
8 Layer PCB
PCB Circuit Board,8 Layer PCB,Custom multilayer pcb,Custom 8 Layer PCB
JingHongYi PCB (HK) Co., Limited , https://www.pcbjhy.com