With the continuous innovation of LED packaging technology and the implementation of energy saving and emission reduction policies at home and abroad, the proportion of LED light source applications in the lighting field is increasing, and new packaging forms are constantly being introduced. Ouyang Minghua, a senior engineer at Yuan Lei, said: "The performance of LEDs in terms of heat dissipation, light efficiency, reliability, and cost performance is still a concern. If these cannot be broken through, or if there are new products other than LEDs in the future, then lighting The field may not choose LEDs. "COB (Chip on Board) is the LED package product launched by the industry under this background. Compared with traditional discrete LED package products, it has better heat dissipation capacity and high density. Luminous flux output. In addition to explaining some of the characteristics of COB, this article focuses on how to improve the light efficiency of COB from the basic principles, and seeks to meet the core value points of lighting.
COB has good heat dissipation capacity
When designing the LED package structure, the junction temperature of the chip should be reduced as much as possible. COB packaged chips have the shortest heat dissipation path, which can quickly transfer the heat of the chip to the metal substrate and then to the heat sink. Therefore, COB has better heat dissipation capacity than traditional discrete component assembly. At present, the materials of COB metal substrates are copper, aluminum, aluminum oxide, aluminum nitride, etc. In terms of overall cost, heat dissipation capacity, anti-corrosion, etc., aluminum is mainly used as the metal substrate to make COB. The following picture shows Yuan Lei COB products Structural drawing.
COB can achieve high-density luminous flux output
When we use LEDs in modular design, we usually don't have much space for the light source. At the same time, we hope to have a sufficiently high brightness output in a small size. This solution is almost not found on discrete components LEDs. Of course, some possibilities Will choose 3535 ceramics or other products with small size and relatively high luminous flux, but they are not comparable to the high-density luminous flux output of COB or MCOB. So the advantages of COB in product modularization are reflected: it helps modular design and maintains a higher luminous flux.
The drive design of COB is very flexible, and the application side can select the COB in combination with the existing driving conditions to meet various solutions from low pressure to high pressure.
COB three modular design drawings
OVERVIEW
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