Samsung Galaxy S9 released disassembly analysis report

Several tech analysts have recently published detailed teardown reports on the upcoming Samsung Galaxy S9, and they all seem to agree that the design lacks surprise compared to its predecessor, the Galaxy S8. Many describe it as too similar or unoriginal in terms of appearance. While this point is hard to argue against visually, Romain Fraux from SystemPlus Consulting in Nantes, France, shared some interesting findings after disassembling the European version of the S9. His team uncovered several hardware innovations that may not be immediately obvious to the average user.

One key discovery was the potential use of a modified semi-additive process (mSAP) in the application processor, a technique also used by Apple in the iPhone X for advanced PCB stacking. In addition, STMicroelectronics appears to be a major beneficiary of the S9’s component selection, with their pressure sensor and a 6-axis inertial measurement unit (IMU) integrated into the device.

Inside the camera module, Samsung has included its own dual-lens system, which is based on Sony’s three-layer stacked CMOS image sensor with embedded DRAM. The camera also features an STMicroelectronics 2-axis MEMS gyroscope for optical image stabilization. Another notable feature is the exclusive iris diaphragm technology that automatically adjusts the aperture depending on lighting conditions.

The S9 also includes a fingerprint sensor, and it's reported that users can unlock the phone using fingerprint, iris scan, or facial recognition. However, unlike the iPhone X, the S9 does not feature a TrueDepth camera system. Apple’s solution uses a combination of dot projectors, infrared cameras, floodlight sensors, and time-of-flight (ToF) sensors to enable Face ID.

Another important component is Broadcom’s RF module, which includes a power amplifier and bulk acoustic wave (BAW) filter supporting both high and medium frequency bands. According to Fraux, this setup is very similar to what Broadcom designed for the iPhone X, suggesting improved integration and performance.

In the front-end wireless market, companies like Broadcom and Qorvo have long dominated, but Qualcomm is now trying to gain ground. However, Fraux noted that Qorvo components were not found inside the S9.

For a closer look at the internal components, here are some images from the disassembly:

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