How to reduce the cost of LED display module from the design

As we all know, the basic unit that constitutes the display box unit is the module. The environment is divided into two types: indoor and outdoor. According to conventional products, the indoor products are composed of a bottom case, a mask, a light board and Accessories, etc.; the composition of outdoor products are: seal ring, bottom case, mask, lamp board, sealant and accessories.



In view of the composition of the modular products, the original design thinking mode is set aside, and the non-independent (correlated) design of each component is carried out according to the design concept of the "integrated" module, which will greatly reduce the module products. The cost can be described in the following aspects:


Integrated design of the light board: As an important part of the module, the cost of the light board will directly affect the sales price of the terminal product, in other words, the profit brought by the product. Generally, the light board is mainly composed of an LED, a circuit board, a driving circuit, and the like composed of the following parts.


For the display manufacturer, the designer separates the separate component products into one module product and combines them by electronic processing to form a module product. If the module product is designed, Partial integration or full integration of these individual components will result in a significant reduction in the cost of the module product.


The first is the integration of the LED chip and the package: the LED chip is directly bonded to the middle layer of the circuit board, and then the sealant is directly poured into the bound recessed hole, thereby forming an integral LED module that is inseparable. As shown in Fig. 1 and Fig. 2 below, the green portion indicates the LED chip, the red portion indicates the sealant, and the black portion indicates the multilayer circuit board.



The module type products adopting this design method are much simpler than the traditional process of producing dot matrix modules , and can be completed by using automatic equipment from the related aspects such as solid crystal, welding wire and point sealant, and the capacity is greatly improved and sealed. The amount of material used is precisely controlled and its usage is greatly reduced.


In terms of cost, compared with the module products manufactured by the conventional process, the cost of the two parts is mainly reduced. The first is the profit of the LED package product market and some of its material costs (bracket and outer casing); the second package product Subsequent electronic processing costs.


Of course, in addition to the above direct cost reduction, there is no reduction in cost, such as the simplification of the processing technology, the increase in production capacity, the increase in product qualification rate, the reduction of manufacturing costs and after-sales service costs; The reduction of links has shortened the production cycle of products; the improvement of efficiency, the reduction of personnel and other factors have improved, resulting in a significant reduction in management costs. The LED manufacturing industry will take a big step towards high-end manufacturing.


Considering the different specifications of the module products, especially the small-pitch and high-density products, the COB- bound production method has a cost reduction of 40-70% compared with the similar products of the current conventional practice, or higher.


Secondly, the integration of drive and control design: for high-density and small-pitch module products, if the existing conventional drive method and control system are used, many components will be used in electrical, which will result in very complicated design. Product reliability and stability have a certain impact, increasing the difficulty in the production, processing, assembly and other processes, in order not to reduce the product's pass rate, relatively speaking, the process control requirements of the product is more stringent.


As the density increases, the amount of information processed by the control card per unit area increases. In order not to reduce related technical indicators such as gradation, refresh rate, etc., the number of control cards used per unit area will increase, in a small space. It is very difficult to make the products have good craftsmanship. If the design is driven by intelligent driving, the above contradictions may be fully solved. The details can be summarized from the following two main aspects:


The driver part (with the IC manufacturer or other joint) greatly enhances the integration of the existing driver IC. According to the current specification information of the small pitch product and the convenience and reliability of the design, the number of ports for driving the output is determined, and at the same time, the output is The pin distribution maximizes the convenience of PCB design. As for the form of the driver IC, it can be packaged and bonded.


For ordinary users, the package format will be more flexible in design and use; for users with bonded devices, the IC can be directly bound to the circuit board, and the driver IC can be easily used. The smaller the size, the lower the cost than the package form, the disadvantage is that it is not universal, and the after-sales service is difficult.


The control part (in conjunction with the control card manufacturer or other) is based on the significant increase in the integration of the driver IC, thereby saving the physical space, and transferring the circuit design of the receiving control card to the driver board, thus driving and The control design together forms an intelligent drive. The effect of this solution not only improves the processability of the product, but also greatly improves the stability and reliability associated with the product.


At the same time, the application of module products will be more flexible. For example, the brightness correction data and chromaticity correction data of the module itself will not be affected by the change or position change; the combination form of the module, the displayed information content, etc. It can be freely transformed, so the use of different ideas will become very simple. Through these changes and improvements, the market will continue to play a positive role in promoting the redevelopment.


Integrated design of sheet metal: Considering the heat dissipation of small-pitch module products or the non-fan heat-dissipation method requirements of other special environmental requirements, pressing aluminum sheets and epoxy sheets will better solve the heat dissipation problem of the module products. Conducive to the adoption of EMC test requirements; making the product as a whole meet the requirements of safety certification.


In summary, the integrated design of the chip and the package and the integrated design of the drive circuit, the organic combination of the two through the circuit board, the formation of the (indoor) integrated module products described herein; The integrated design of the receiving control card can be integrated into the driving design, and then the (indoor) intelligent driving integrated module product described in this paper is formed.


Integration of indoor and outdoor products: The indoor and outdoor module products used in the market at present are completely different in design. The kits for indoor use do not need to be waterproof. The kits for outdoor use need to be waterproof, and most of them need to be sealed and waterproof. For the silicone, the waterproof sealing ring should be installed on the end surface of the fixed structure.


The integrated module type indoor product can be used without the plastic kit, and the mounting and connecting device can be directly soldered to the circuit board, and it is not necessary to be connected with the bottom case without the conventional module. At the same time, since the light-emitting device is embedded in the circuit board, the anti-collision performance of the product is much better than conventional ones during use and transportation.


As for the outdoor products of the integrated module type, the indoor products of the integrated module type can be reduced in a certain range (for example, 0.5 mm) in the long and wide outer dimensions, and the integrated module can be mounted on the light emitting surface to have an optical The characteristic and completely sealed housing, together with the supporting bracket and sealing ring, forms an integrated module type that can be used outdoors, eliminating the need for the conventional module to be potted with waterproof silicone.


At the same time, the outer casing of optical characteristics breaks through the limitation of the light distribution curve of existing LED packaging products, and realizes the custom application of the product in secondary development or meeting the special environment of the market. As shown in the following figure, Figure 3 shows the indoor type, and Figure 4 shows the outdoor type. In summary, the realization of the integrated LED display module products not only brings the advantages of cost reduction, process simplification, and productivity improvement, but also It can also realize the fully automated production of LED module products. In a sense, the integrated module products are products integrated in the industry chain.


However, while bringing many benefits, it may have an impact on some existing packaging products (mainly for small-pitch packaging products); and some intermediate links in the industry chain [such as pure packaging companies, (only Limited to the display industry, the electronic processing industry, the driver IC trader, the plastic kit factory, the waterproof material factory, etc.] have a greater impact.



At the same time, the related industries supporting the display will also have new development opportunities, such as automation supporting production equipment, circuit board factory, IC manufacturing, new heat dissipation materials, packaging materials and so on. The integrated LED module products described in this paper only represent the individual's prediction of the future development of the display industry, and how the actual development is determined by the market itself.

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