2015 process upgrade: Samsung 14nm vs. TSMC 16nm

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Currently, the development of mobile phone processors has reached a point where it's difficult to push further. The ARM Cortex-A53 and Cortex-A57 architectures are no longer new, and their products are already on the market. With no major architectural innovation, improving performance comes at the cost of higher power consumption. Besides process upgrades, it's hard to imagine any other way to achieve a significant improvement in smartphone SoCs in a short time.

Kim Ki-nam, President of Samsung Semiconductor, recently announced that Samsung’s 14nm FinFET process is progressing smoothly, with customers already in production. While the identity of the customer remains unclear, the most likely candidate is Apple. The S1 chip used in the Apple Watch is currently facing power consumption challenges, making the adoption of the new 14nm process a logical choice. It's also possible that the upcoming A9 chip for the next iPhone will be manufactured using this advanced technology. Another potential client could be Qualcomm, given their foundry agreement with Samsung.

Samsung claims that its 14nm FinFET process offers a 20% performance boost over TSMC’s 20nm, reduces power consumption by 35%, and shrinks the footprint by 15%. This represents a comprehensive improvement. However, TSMC’s 16nm FinFET technology is not far behind and is already being widely used. As the mobile SoC market prepares for a major process upgrade in the coming years, the competition between Samsung and TSMC is expected to intensify.

2015 Process Upgrade: Samsung 14nm vs. TSMC 16nm

The 14nm FinFET process wafer from Samsung has now entered mass production, marking a significant milestone in semiconductor manufacturing. This advancement is expected to have a major impact on future smartphone designs and performance capabilities.

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