Daicel - Evonik develops LED component technology with hot melt adhesives

Japan's Daisuke - Evonik has developed a technology for packaging LED components with hot melt adhesives (thermoplastic adhesives). Hot melt adhesives are widely used as encapsulating materials and injection molding materials in addition to the original bonding applications. At present, the big game èµ¢-Evonik is selling the adhesive to LED luminaire manufacturers, and some manufacturers have started to negotiate with them.

Since the hot melt adhesive gradually turns yellow under the light and heat of the LED, it has not been used in LED lamps. This new method solves the problem of yellowing by combining the polyamide-based hot melt adhesive of Daicel-Evonik and the acrylic resin excellent in heat resistance and light resistance.

Specifically, a lens of another injection-molded acrylic resin material is placed on a mold, and a wired LED element is placed thereon, and then hot-melt adhesive injection molding (insert molding) is performed. This enables simultaneous LED component packaging and lamp housing molding.

Figure: LED lamp packaged with hot melt adhesive

In addition, in the most severe photothermal environment, the part connected to the light-emitting surface of the LED element is replaced with an acrylic resin excellent in heat resistance and light resistance, so the heat resistance and light resistance of the existing hot-melt adhesive are improved. It is also completely sufficient. The propylene resin and the polyamide-based hot-melt adhesive are firmly combined by a chemical reaction, and also ensure sufficient waterproof and moisture-proof properties.

The original process is to install the wired LED component on the lamp housing, seal the coating material on the part connected to the wiring, seal the surrounding with a gasket, attach the lens, and finally weld the surrounding with heat and laser. section. The method developed this time can replace the complicated assembly process with one insert molding, so that the manufacturing cost can be drastically reduced.

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