SanDisk has introduced the new SanDisk® iNANDTM Embedded Flash Drives (EFD), which supports the e.MMC 4.4 specification. Based on 3-bit-per-cell (X3) NAND flash technology, these drives deliver up to 64GB1 of capacity in a single component and can be used for boot, system code and mass storage functions.
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More and more mobile phones offer a variety of applications and high-volume content, such as movie and music playback, photo photography, games, GPS map data, business applications and more. SanDisk iNAND EFDs are designed for these advanced smartphones and offer high capacity and reliable storage in a small, high-efficiency volume.
SanDisk's X3 technology makes high-capacity embedded storage possible. SanDisk's advanced X3 technology drives the development of high-capacity embedded solutions that are extremely durable, efficient, and minimally complex. In recent years, SanDisk has successfully developed and widely distributed a variety of X3-based products through original equipment manufacturers (OEMs) and retail channels. This not only proves that the technology is mature, but also proves that SanDisk has the ability to provide reliable market. Innovative solutions.
SanDisk's memory management expertise and X3 controller technology enable mobile storage solutions to evolve continuously and at low cost. 64GB iNAND EFDs meet the reliability and high performance requirements of original equipment vendors for mobile system-level storage. The new 64GB iNAND EFDs are based on an 8-flash die-stack design that utilizes SanDisk's advanced X3 32-nm flash memory and is 16x20x1.4mm in a standard ball grid array (BGA) package. For quick integration into smartphone designs.
Oded Sagee, Director of Mobile Product Marketing at SanDisk, said: "The maturity of SanDisk X3 flash technology and innovation in flash management have enabled us to continuously transform higher embedded storage capacity (64GB) into a practical solution on the market. We understand the fierce competition in our customers' environment. By leveraging the extensive experience of X3 NAND and the significant advances in flash management technology, we provide our customers with a high return on investment."
Highest efficiency optimization
SanDisk iNAND EFD integrates system code and user storage into a single embedded device to save valuable board space, simplify smartphone design, reduce power consumption, and save OEMs the need to start a separate component cost. In addition, these drives utilize a unique state-aware architecture that enables mobile hosts to enhance control of storage devices, resulting in optimized resource utilization and faster system responsiveness.
The i3 device based on X3 technology is fully compliant with e.MMC 4.4 and has a capacity of 4GB to 64GB.
A shielded cable is an electrical cable of one or more insulated conductors enclosed by a common conductive layer. The shield may be composed of braided strands of tinned copper, stainless steel wire, or a layer of conducting polymer. Usually this shield is covered with a jacket. Yangzhou Fongming Cable offers very high temperature metal shielded cable, like stainless steel shielded cable and tinned copper shielded cable with fiberglass braiding. Single core, 2 cores, 3 cores or multi cores high temperature shield cable and wire is one of our famous production.
Structure:
Conductor: Single stranded tinned copper wire, Nickel Plated Copper Wire or pure nickle wire.
Insulation: PVC, Silicone, Teflon, Fiberglass.
Braiding: fiberglass, polyester yarn braiding.
Impregnation: high temperature impregnating lacquer.
Shield: Stainless steel wire, tinned copper wire, galvanized wire, polymer.
Color: can be customized.
Rated voltage: 300V, 600V
Rated temperature range: -40℃~+450℃
Typical application: The use of shielded cables in security systems provides some protection from power frequency and radio frequency interference, reducing the number of false alarms being generated. The best practice is to keep data or signal cables physically separated by at least 3 inches (75mm) from 'heavy' power circuits which are in parallel..
Size
(AWG)
Conductor
Structure
(mm)
Insulation
Thickness
(mm)
Jacket
Thickness
(mm)
Shield
Thickness
(mm)
O.D
(mm)
3*12
65/0.254
0.52
0.2
0.2
8.6±0.3
FAQ:
1. Why the price is so low?
2.Where is your factory located? How can I visit there?
3.Can I get some samples?
4. Can you make the products with my design?
Yes. customization is welcome .
You are ordering directly from the factory.
Our factory is located in Yangzhou City, Jiangsu Province, China,which is near Shanghai. All our clients, from home or abroad, are warmly welcomed to visit us.
Yes, we are honored to offer you samples.
Shield Wire,Multi Core Shield Wire,3 Core Shield Wire,Stainless Steel Shield Wire
Yangzhou Fongming Cable Factory , http://www.hightemperaturewire.com